EDSYN TSX713

SOLDAVAC Reflow Vacuum Tip Hole Dia: .05 in. (1.3 mm) L: .55 in. (14.0 mm)

TSX713
TSX713

EDSYN TSX713

SOLDAVAC Reflow Vacuum Tip Hole Dia: .05 in. (1.3 mm) L: .55 in. (14.0 mm)

TSX713
TSX713

The EDSYN TSX713 SOLDAVAC Reflow Vacuum Tip (.05 in.) is designed for use with SOLDAVAC workstations for reflow soldering.

  • Diameter: .05 in. (1.3 mm)
  • Length: .55 in. (14.0 mm)
  • For use with SOLDAVAC workstations
  • Ideal for reflow soldering applications
$27.55

The EDSYN TSX713 SOLDAVAC Reflow Vacuum Tip Hole Dia: .05 in. (1.3 mm) L: .55 in. (14.0 mm)

More Information
BrandEDSYN
ConditionNEW